Vertiv’s CoolLoop Trim Cooler demonstrates how data centres could reduce energy consumption and cool the next-generation of AI infrastructure
The surge in artificial intelligence applications has intensified cooling requirements in data centres worldwide. Liquid cooling technologies have emerged as a response to the growing thermal challenges of AI workloads in data centres, with potential environmental benefits in addition to possible performance improvements.
As AI accelerators and high-performance computing (HPC) systems generate high heat densities – often exceeding 100kW per rack – conventional air cooling systems can struggle.
“AI [requires] innovative approaches to managing the thermal challenges inherent in 100kW+ racks,” said Sam Bainborough, vice president of thermal business EMEA at Vertiv.
Vertiv recentlyintroducedthe CoolLoop Trim Cooler in this competitive space. It claims an up-to-70% reduction in annual cooling system energy consumption compared to traditional cooling methods – a figure that reflects the industry’s push toward more efficient thermal management solutions.
The challenge sits at the balance between technological advancement and environmental responsibility, with data centre operators seeking solutions to handle greater loads yet minimise energy consumption and carbon footprint.
“[The] announcement, and the ongoing expansion of Vertiv’s industry-leading high-density thermal management portfolio, allow us to deliver […] liquid cooling and chilled water solutions to meet our customers’ AI-driven demands,” Bainborough said.
Engineering for efficiency and flexibility
The Vertiv CoolLoop Trim Cooler, announced on March 11, 2025, is designed to address the cooling challenges presented by high-density computing environments. What sets this solution apart is its hybrid approach – it’s capable of supporting liquid and air cooling configurations in one system.
The flexibility proves important as many data centres upgrade and reconfigure in transitional stages, running traditional air-cooled infrastructure alongside newer liquid-cooled AI clusters. The system integrates with Vertiv’s CoolChip CDU coolant distribution units for direct-to-chip cooling and supports connection to immersion cooling systems.
It’s engineered specifically to operate with the different water temperatures required by AI applications, supporting supply temperatures up to 40°C and cold plate functionality at 45°C.
Environmental considerations
Advanced liquid cooling aligns well with sustainability goals. The CoolLoop Trim Cooler uses a low-GWP (global warming potential) refrigerant and can scale to a cooling capacity that reaches nearly 3 MW in air-cooled configurations.
The system is designed to maximise free cooling operation, using ambient air to cool infrastructure whenever possible rather than more energy-intensive mechanical cooling. It operates in free cooling mode in all seasons and under more conditions than previous-generation cooling solutions. The CoolLoop Trim Cooler complies with upcoming 2027 EU F-GAS regulations, helping protect data centre operators from future infrastructure upgrade costs.
Space optimisation
Beyond energy efficiency, space utilisation is a concern for data centre operators. The CoolLoop Trim Cooler delivers approximately 40% space savings compared to traditional cooling systems, an advantage if facilities wish to expand to accommodate growing AI workloads.
The design could be valuable in urban environments where space to expand can be limited by available real estate. By reducing the physical footprint required for cooling infrastructure, data centres can dedicate more space to computing resources without expanding overall facility size.
Industry context
According to industry analysts, the global data centre liquid cooling market is projected to grow at a CAGR of over 20% through to 2028, driven primarily by AI and HPC applications. The growth reflects the technical need for liquid cooling for high-density deployments.
The way forward
As AI continues to grow its role in business operations in many sectors, data centre infrastructure is evolving to support the heavier compute and storage workloads. Liquid cooling represents a promising way forward, helping to ensure that the growth of AI doesn’t come at an unsustainable environmental cost.
